Apple Readies 2nm A20 Pro Chip for iPhone 18 Pro, Adding WMCM Packaging
Updated
Updated · 9to5Mac · Jul 20
Apple Readies 2nm A20 Pro Chip for iPhone 18 Pro, Adding WMCM Packaging
3 articles · Updated · 9to5Mac · Jul 20
Summary
Apple’s rumored A20 Pro for this fall’s iPhone 18 Pro and iPhone Ultra would pair a 2-nanometer process with Wafer-Level Multi-Chip Module packaging, marking two major chip changes at once.
The shift from 3nm to 2nm is expected to deliver more performance and better power efficiency within a similar chip size, giving Apple more room to boost next-generation features.
WMCM would integrate the SoC and DRAM at the wafer level without an interposer or substrate, improving thermal behavior and signal integrity by placing memory physically closer to the processor.
That design could especially help AI workloads and high-end gaming, aligning with expectations that iOS 27 will lean heavily on AI features across Apple’s next iPhone lineup.